ʻO ka Busbar Honua Keleawe Paʻa no nā ʻōnaehana Hoʻoheheʻe Hilinaʻi

Wehewehe Pōkole:

Nā kikoʻī huahana

Inoa: ʻO ka pahu kaʻa honua i hoʻopaʻa ʻia
Kūlana:GB/T 11091, EN 13599, GB/T 5231, IEC 60228, ISO 197-1, ASTM B187 / B187M
Mea: Tu2, T1, T2, C10200, C11000, C103, C101, DINOF-Cu, DINE-Cu58, CW008A, CW004A, H90, H96, H85, H80, H70, H68, H65, H63, H62, H59
ʻIli: ʻIli
Anawaena: E like me ka mea e pono ai
Lōʻihi: E like me ka mea e pono ai
Nā Hiʻohiʻona Huahana: Ke alakaʻi uila kiʻekiʻe, Paʻa wela, Kū'ē i ka palaho, Ka hiki ke hana
Kahua Noi: Keʻena Kelepona, Mea Hoʻololi, Puʻu Hoʻouka, Substation ʻAno Pahu, Lako Hoʻololi Wela (e laʻa, Condenser), Nā Mea Hoʻoheheʻe Honua, ʻŌnaehana Hydraulic a me nā Pipelines Mea Hana


Nā kikoʻī huahana

Nā Lepili Huahana

Wikiō

ʻO ka Oxygen-Free Copper (TU1) Electroplated Busbar no nā noi Terminal Grounding - Kaʻina hana a me ka ʻōlelo hōʻoia maikaʻi

Hana ʻia ke kaʻa pahi mai ke keleawe TU1 ʻole oxygen (Cu ≥99.97%) me nā pōʻaiapuni huki anu a me ka annealing he nui e hoʻokō ai i ka hoʻonohonoho ʻana o ka palaoa i hoʻomaʻemaʻe ʻia, elongation ≥38%, a me ka ikaika tensile ≥245 MPa. ʻAʻohe porosity kūloko a me nā inclusions o ke substrate, e hāʻawi ana i ka hoʻopili kūpono no ka plating ma hope.

Hoʻohana ka mālama ʻana i ka ʻili i ke kala kiʻekiʻe a i ʻole ka electroplating tin (mānoanoa kālā maʻamau 15-30 μm, tin 10-20 μm; hiki ke hoʻonui ʻia i ≥50 μm e like me ka kikoʻī o ka papahana). Hoʻomalu ʻia ke ʻano like o ka uhi ʻana i loko o ±10%, a ua kūlike ka hoʻopili ʻana me ka Pae 5 no GB/T 5270-2019, me ka ʻole o ka ʻili ʻana a i ʻole ka hemo ʻana ma hope o ke kūlou ʻana o 180°. Loaʻa i nā wahi kikowaena honua koʻikoʻi ka mānoanoa lua kūloko e hōʻoia i ka pale ʻana o ka pili ʻana e mau ana ≤10 μΩ ma lalo o ka nui o ke au kiʻekiʻe, ʻoiai ke piʻi ʻana o ka mahana e kūlike me nā kūlana GB 8349 a me IEC 61439.

Hana ʻia ka hana piha ma lalo o kahi ʻōnaehana hoʻokele maikaʻi i hōʻoia ʻia e IATF 16949 me nā kaohi aʻe:

● 100% loiloi spectrometer heluhelu pololei o ka haku mele ʻana o nā mea maka + hōʻoia keʻena hoʻokolohua i ʻae ʻia e CNAS ʻaoʻao ʻekolu
● Hoʻāʻo pūʻulu no ka conductivity (≥100% IACS), ka mānoanoa o ka uhi (X-Ray fluorescence), ka hoʻopili ʻana (bend + thermal shock), a me ke kū'ē ʻana i ka paʻakai (kālā ≥480 h, tin ≥240 h no ka ASTM B845 neutral salt spray)
● Nānā ʻia me ka hoʻoikaika ʻia 100% a me ke ana ʻana o ke kū'ē ʻana i kēlā me kēia pili; hiki ke hahai piha ʻia ma o ke code QR no kēlā me kēia pā
● Ke kūpaʻa hope loa i ka insulation voltage kiʻekiʻe (2500 V/1 min, ʻaʻohe haki) a me ka hōʻoia hoʻomau honua

Hoʻohana nui ʻia ka huahana i nā ʻōnaehana UPS/EPD kikowaena ʻikepili, nā BMS mālama ikehu unahi-pono, nā mea hoʻololi HV, ke kaʻaahi kaʻaahi, a me nā panela automation ʻoihana kahi e koi ʻia ai ka hilinaʻi nui loa. Ua hoʻokumu ʻia ka lako paʻa lōʻihi me nā mea kūʻai aku alakaʻi e like me State Grid Corporation o Kina, China Southern Power Grid, China Mobile, Sinopec, BYD, CATL, Huawei, ZTE, a me nā mea ʻē aʻe.

ʻO nā hiki hana maʻamau e komo pū me ka punching kūikawā, nā uhi insulation (epoxy powder a i ʻole PVC dip), nā lōʻihi hoʻokahi lōʻihi loa (a hiki i 12 m), a i ʻole nā ​​​​ʻōnaehana plating kūikawā (Ni undercoat + Au finish, etc.). Loaʻa ke kākoʻo loea piha mai ka loiloi kaha kiʻi ma o ka hoʻāʻo ʻano ma ke noi.


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