Nā ʻĀpana Keleawe Maʻemaʻe i Kulou ʻia a Puni ʻia - Kūkulu ʻia e like me kāu mau kikoʻī

Nā ʻāpana keleawe maʻemaʻe kiʻekiʻe-pololei

He loea mākou i ka hana ʻana i nā ʻāpana i hoʻopau ʻia me ka pololei kiʻekiʻe mai ke keleawe C11000/C10100 (Cu ≥ 99.99%), e lawelawe ana i nā mea kūʻai aku nui i ka ikehu hou, ka hoʻopili mana, ka hoʻokele wela, nā mea hoʻohui coaxial RF, a me nā ʻoihana lako ʻoihana kiʻekiʻe.

Nā Kaʻina Hana Hana Koʻikoʻi

● Mea maka: Pitch electrolytic tough pitch (ETP) kiʻekiʻe-maʻemaʻe a i ʻole nā ​​​​​​ingots keleawe ʻole oxygen (Cu ≥ 99.99%)
● Hoʻoheheʻe ʻia: Ka umu hoʻokomo alapine waena ma lalo o ka vacuum a i ʻole ka lewa pale e hōʻemi i ka nui o ke kinoea
● Nā ala hana: Hoʻoheheʻe wela/poʻo anu → Extrusion anu multi-station → Machining hui wili-wili CNC Precision → Deburring + hoʻomaʻemaʻe ultrasonic
● Hoʻopau ʻili: Hoʻomehana ʻālohilohi, koho a i ʻole ka electroplating piha (Ag, Au, Sn, Ni) e like me nā kūlana IPC-4552/4553
● Pololei o ke ana: Ke ahonui maʻamau ±0.01 mm; hiki ke hoʻokō ʻia nā hiʻohiʻona koʻikoʻi a hiki i ±0.005 mm (e hilinaʻi ana i ka ʻāpana)

ʻŌnaehana Mana Kūlana

● Hana ʻia ma lalo o ka ʻōnaehana hoʻokele maikaʻi piha o IATF 16949
● Nā mea e hiki mai ana: 100% heluhelu pololei ʻana i ka loiloi haku mele spectrometer + ka hoʻāʻo ʻana i ka hydrogen embrittlement a me ka ʻike oxygen
● Nānā ʻana i waho: Conductivity (IACS%), mānoanoa o ka plating (X-Ray), pipili (bend/thermal shock), hana paʻakai-spray, hōʻike piha piha, a me ka Palapala Hōʻoia Mea 3.1 me ka hiki ke hahai piha i ka ingot batch
● Hana ʻana o ka helu kīnā: DPPM < 50 no nā pūʻulu moʻokāki koʻikoʻi

Ke kālele nei mākou i ka hāʻawi ʻana i nā ʻano like ʻole o ka lot-to-lot a me ka ʻikepili hiki ke hahai piha ʻia ma mua o nā ʻōlelo hoʻolaha kūʻai aku. Hiki iā ʻoe ke waiho i nā kiʻi a i ʻole nā ​​​​laʻana kino; hoʻopau pinepine mākou i ka loiloi kaʻina hana a hāʻawi i kahi hōʻike DFM a me ka ʻōlelo kūhelu i loko o 3-5 mau lā hana.